Method of manufacturing light emitting device having fluorescent and light scattering light-transmissive member

ABSTRACT

A method for manufacturing a light emitting device includes: placing a light-transmissive member, which includes first and second regions, above a light emitting element so that the first region of the light-transmissive member is positioned directly above a top surface of the light emitting element, and a lateral surface of the light emitting element and a bottom surface of the second region of the light-transmissive member are covered by a light guide member; and covering an outer surface of the light guide member with a light reflective member. The light-transmissive member contains a fluorescent substance and a light scattering material, a concentration of the fluorescent substance in the light-transmissive member is higher in the first region than in the second region, and a concentration of the light scattering material in the light-transmissive member is higher in the second region than in the first region.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a divisional application of U.S. patent applicationSer. No. 15/876,517 filed on Jan. 22, 2018. This application claimspriority to Japanese Patent Application No. 2017-010533, filed on Jan.24, 2017. The entire disclosures of U.S. patent application Ser. No.15/876,517 and Japanese Patent Application No. 2017-010533 are herebyincorporated herein by reference.

TECHNICAL FIELD

The present disclosure relates to a light emitting device and a methodfor manufacturing the same.

BACKGROUND ART

For example, in Japanese Laid-Open Patent Application Publication No.2015-115480, a light emitting device is described that includes: a blueLED element in which a negative electrode and a positive electrode areformed on a bottom surface thereof; a phosphor layer disposed on a topsurface of the LED element to emit white light as a whole; reversedsquare pyramid shaped transparent resin parts disposed on lateralsurfaces of the LED element and having a bottom surface on which thephosphor layer is disposed; and a reflecting wall covering exposedsurfaces, which are surfaces other than the bottom surface of the LEDelement and the top surface of the phosphor layer.

SUMMARY

In the light emitting device described in Japanese Laid-Open PatentApplication Publication No. 2015-115480 described above, a portion ofthe phosphor layer in a region directly above the transparent resin parthas heat dissipation performance lower than heat dissipation performanceof a portion of the phosphor layer in a region directly above the LEDelement, and thus is easily degraded. However, if the phosphor in thisregion is removed, light emitted from the LED element is emitted towardobliquely above the light emitting device without being mixed with lightfrom the phosphor, so that great unevenness in emission colordistribution may be occurred.

In light of that, one object of one embodiment of the present inventionis to provide a light emitting device in which heat in a fluorescentsubstance can be easily dissipated and unevenness in the light emissioncolor distribution can be reduced. Also, one object of anotherembodiment of the present invention is to provide a method ofmanufacturing such a light emitting device with good productivity.

A method for manufacturing a light emitting device according to anotherembodiment of the present invention includes: providing alight-transmissive member, the light-transmissive member including afirst region and a second region at a lateral side of the first region,above a light emitting element so that the a first region of thelight-transmissive member is positioned directly above a top surface ofthe light emitting element and a lateral surface of the light emittingelement and a bottom surface of the second region of thelight-transmissive member are covered by a light guide member; andcovering an outer surface of the light guide member with a lightreflective member. The light-transmissive member contains a fluorescentsubstance and a light scattering material that is not a fluorescentsubstance. A concentration of the fluorescent substance in thelight-transmissive member is higher in the first region than in thesecond region. A concentration of the light scattering material in thelight-transmissive member is higher in the second region than in thefirst region.

According to certain embodiments of the present invention, it ispossible to obtain a light emitting device in which heat in thefluorescent substance can be easily dissipated and unevenness in thelight emission color distribution can be reduced. Also, according toanother certain embodiments of the present invention, it is possible tomanufacture such a light emitting device with good productivity.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a schematic top view of a light emitting device according toa first embodiment of the present invention.

FIG. 1B is a schematic cross sectional view of the light emitting devicetaken along a line A-A in FIG. 1A.

FIG. 1C is a schematic cross sectional view of the light emitting devicetaken along a line B-B in FIG. 1A.

FIG. 2A is a schematic cross sectional view showing one stage of themethod of manufacturing a light emitting device according to the firstembodiment of the present invention.

FIG. 2B is a schematic cross sectional view showing one stage of themethod of manufacturing a light emitting device according to the firstembodiment of the present invention.

FIG. 2C is a schematic cross sectional view showing one stage of themethod of manufacturing a light emitting device according to the firstembodiment of the present invention.

FIG. 2D is a schematic cross sectional view showing one stage of themethod of manufacturing a light emitting device according to the firstembodiment of the present invention.

FIG. 3A is a schematic top view of the light emitting device accordingto a second embodiment of the present invention.

FIG. 3B is a schematic cross sectional view of the light emitting devicetaken along a line C-C in FIG. 3A.

FIG. 3C is a schematic cross sectional view of the light emitting devicetaken along a line D-D in FIG. 3A.

FIG. 4A is a schematic cross sectional view showing one stage of themethod of manufacturing a light emitting device according to the secondembodiment of the present invention.

FIG. 4B is a schematic cross sectional view showing one stage of themethod of manufacturing a light emitting device according to the secondembodiment of the present invention.

FIG. 4C is a schematic cross sectional view showing one stage of themethod of manufacturing a light emitting device according to the secondembodiment of the present invention.

FIG. 4D is a schematic cross sectional view showing one stage of themethod of manufacturing a light emitting device according to the secondembodiment of the present invention.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Hereafter, certain embodiments of the present invention will beexplained with reference to the drawings as appropriate. The lightemitting device and the method of manufacturing the same explainedhereafter are intended to give a concrete form to the technical idea ofthe present invention, and unless specifically described otherwise, thepresent invention is not limited to the description below. Also,description in one embodiment may also be applied to another embodiment.The size, positional relationship, etc., of the members shown in thedrawings may be exaggerated for ease of explanation.

In the drawings, a width direction of the light emitting device isreferred to as an “X direction”, a depth direction of the light emittingdevice is referred to as an “Y direction”, and an upper-lower (i.e.,thickness) direction of the light emitting device is referred to as a “Zdirection”. Each of the X, Y, and Z directions (i.e., axes) is adirection (i.e., axes) perpendicular to the other two directions (i.e.,axes) of the X, Y, and Z directions. In more detail, a rightwarddirection is referred to as an “X+ direction”, a leftward direction isreferred to as an “X− direction”, a backward direction is referred to asa “Y+ direction”, a frontward direction is referred to as a “Y−direction”, an upward direction is referred to as a “Z+ direction”, anda downward direction is referred to as a “Z− direction”. A principallight emitting direction of the light emitting device is the upwarddirection. A lateral direction refers to, for example, a directionparallel to a plane extending in the width direction and the depthdirection, specifically, the XY plane.

Also, a “wavelength range of visible light” refers to a wavelength rangeof 380 nm to 780 nm, a “blue light range” refers to a wavelength rangeof 420 nm to 480 nm, a “green light range” refers to a wavelength rangeof 500 nm to 560 nm, a “yellow light range” refers to a wavelength rangeof longer than 560 nm and 590 nm or less, and a “red light range” refersto a wavelength range of 610 nm to 750 nm.

Further, the expression “light-transmissive” as used in the presentspecification refers to having light transmittance of 60% or greater,more preferably 70% or greater, and even more preferably 80% or greaterwith respect to light with emission peak wavelength of the lightemitting element. The expression “light reflective” as used in thepresent specification refers to having a light reflectance of 60% orgreater, more preferably 70% or greater, and even more preferably 80% orgreater with respect to light with the light emission peak wavelength ofthe light emitting element is.

First Embodiment

FIG. 1A is a schematic top view of a light emitting device 100 accordingto the first embodiment of the present invention. FIG. 1B is a schematiccross sectional view of the light emitting device 100 taken along a lineA-A in FIG. 1A. FIG. 1C is a schematic cross section view of the lightemitting device 100 taken along a line 1-B in FIG. 1A.

As shown in FIG. 1A to 1C, the light emitting device 100 of the firstembodiment includes a light emitting element 10, a light-transmissivemember 20, a light guide member 30, and a light reflective member 40.The light-transmissive member 20 is placed above the light emittingelement 10. The light-transmissive member 20 comprises a first region 20a positioned directly above a top surface of the light emitting element10, and a second region 20 b at a lateral side of the first region 20 a.The light guide member 30 covers the side surface of the light emittingelement 10 and a bottom surface of the second region 20 b of thelight-transmissive member. The light reflective member 40 covers theouter surface of the light guide member 30. The light-transmissivemember 20 contains a fluorescent substance 25, and a light scatteringmaterial 28 that is not a fluorescent substance. Also, the concentrationof the fluorescent substance 25 is higher in the first region 20 a thanin the second region 20 b. Further, the concentration of the lightscattering material 28 is higher in the second region 20 b than in thefirst region 20 a.

In the light emitting device 100 having such a configuration, with theconcentration of the fluorescent substance 25 in the light-transmissivemember 20 higher in the first region 20 a than in the second region 20b, heat emitted by the fluorescent substance 25 is easily drawn via thelight emitting element 10, which has relatively high thermalconductivity, and heat generation and heat retention in the secondregion 20 b can be reduced.

Thus, degradation of the second region 20 b due to heat can be reduced.Accordingly, degradation of the light guide member 30 that is adjacentto the second region 20 b can be reduced. Thus, it is possible toincrease the reliability of the light emitting device 100. Also, in thelight emitting device 100, with the concentration of the lightscattering material 28 in the light-transmissive member 20 higher in thesecond region 20 b than in the first region 20 a, the light emitted fromthe light emitting element 10 is more easily scattered in the secondregion 20 b, the directivity of light of the light emitting element 10in the obliquely-upward direction of the light emitting device isreduced, and thus unevenness in the light emission color distributioncan be reduced. Also, light scattering due to the light scatteringmaterial 28 allows for increasing incident of light emitted from thelight emitting element 10 to be incident on the fluorescent substance25, so that relatively high wavelength conversion rate in the secondregion 20 b, in which the concentration of the light scattering material28 in increased, contributes to reduction of unevenness in the lightemission color distribution. Furthermore, with the light scatteringmaterial 28, thermal conductivity of the second region 20 b may beincreased. The light scattering material 28 is not a fluorescentsubstance, so that heat generation thereof is small, and thus does noteasily cause degradation of the second region 20 b due to heat even witha high concentration. Therefore, the light emitting device 100 can be alight emitting device in which heat can be easily drawn from thefluorescent substance 25 and unevenness of the light emission colordistribution can be reduced.

The concentration of the fluorescent substance 25 and the lightscattering material 28 is preferably a volumetric concentration from theperspective of its action. This is similar in the concentration of asecond fluorescent substance 26 described below.

Also, as shown in FIG. 1A, in the first embodiment, thelight-transmissive member 20 has a rectangular shape in a top view, andthe light guide member 30 has a circular shape in a top view. With suchshapes, the second region 20 b has a region directly above the lightguide member 30, and a region at a lateral side of that and directlyabove the light reflective member 40. Light with the high radiant fluxemitted from light emitting element 10 is incident on the regiondirectly above the light guide member 30 through the light guide member30, which can facilitate light emission of the fluorescent substance 25.Also, generally, the light reflective member 40 contains a large amountof pigment, etc. for providing light reflectivity, and has a thermalconductivity higher than that of the light guide member 30 that requireshigh light-transmissivity. Accordingly, in the second region 20 b, inparticular in the region directly above the light guide member 30,temperature is easily increased and thus degradation occurs easily.Therefore, the region in the second region 20 b where temperature iseasily increased is in accordance with an area covered by the lightguide member 30 on a lower surface of the second region 20 b.

Also, in view of uniformity of heat dissipation and light emission colordistribution, it is preferable that the center of the light emittingelement 10 in the top view substantially corresponds to the center ofthe light-transmissive member 20 in the top view. When the center of thelight emitting element 10 in the top view and the center of thelight-transmissive member 20 in the top view are separated from eachother, the separation distance therebetween is preferably a half orless, more preferably a quarter or less of the minimum width of thesecond region 20 b when the center of the light emitting element 10 inthe top view corresponds to the center of the light-transmissive member20 in the top view. In the case where a plurality of light emittingelements are connected to a single light-transmissive member, the centerof a virtual shape formed by connecting an outermost periphery of theplurality of light emitting elements in the top view can be regarded asthe center of the light emitting elements in the top view.

Hereafter, a detailed description is given of preferred embodiments ofthe light emitting device 100.

The light scattering material 28 can realize Rayleigh scattering, whichcan greatly increase scattering intensity of short wavelength light, sothat scattering of the light of the light emitting element 10 in thesecond region 20 b is effectively obtained, and it is easier to reduceunevenness in the light emission color distribution of the lightemitting device 100. Therefore, the average particle diameter of thelight scattering material 28 is preferably smaller than the lightemission peak wavelength of the light emitting element 10, morepreferably is ⅕ or less of the light emission peak wavelength of thelight emitting element 10, and even more preferably is 1/10 or less ofthe light emission peak wavelength of the light emitting element 10.More specifically, the average particle diameter of the light scatteringmaterial 28 is preferably smaller than 500 nm, more preferably smallerthan 100 nm, and even more preferably smaller than 50 nm. The averageparticle diameter of the light scattering material 28 is, for example, 1nm or greater. This average particle diameter is preferably a primaryparticle diameter, but aggregation of the particles may not be ignored,and may be a secondary particle diameter. The average particle diametercan be defined by D₅₀. Also, the average particle diameter can bemeasured using an image analysis method (e.g., scanning electronmicroscopy (SEM), transmission electron microscopy (TEM)), a laserdiffraction and scattering method, a dynamic light scattering method, asmall angle X-ray scattering method, etc. Among these, in view ofmeasurement of the particle diameter of particles that is present in amember, an image analysis method is preferable. The image analysismethod conforms to JISZ8827-1: 2008, for example.

As shown in FIGS. 1B and 1C, with the light emitting device 100 of thefirst embodiment, the concentration of the fluorescent substance 25 islowest at the side end part of the second region 20 b, and is highest atthe center part of the first region 20 a. In the light-transmissivemember 20, toward lateral ends thereof, in other words, toward thelateral surfaces thereof, the light path length from the light emittingelement 10 is increased, and thus also the wavelength conversion rate ofthe light emitted from the light emitting element 10 due to thefluorescent substance 25 is increased easily. Also, toward the lateralsurfaces the light-transmissive member 20, the distance from the lightemitting element 10 is increased, and thus the heat dissipation isdecreased easily. Therefore, with the fluorescent substance 25distributed at a low concentration at the lateral end part of the secondregion 20 b, and at a high concentration at the center part of the firstregion 20 a, unevenness in the light emission color distribution iseasily reduced, and heat is easily drawn from the fluorescent substance25. In particular, in the example shown in FIGS. 1B and 1C, thefluorescent substance 25 is disposed over the center part of the firstregion 20 a and the lateral end part of the second region 20 b. In moredetail, the fluorescent substance 25 is continuously between the centerpart of the first region 20 a and the lateral end part of the secondregion 20 b. Also, the concentration of the fluorescent substance 25 isgradually increased from the lateral end of the second region 20 b tothe center of the first region 20 a. The expression “center part” of thefirst region 20 a includes a region at a distance of 5% or less of themaximum width of the light-transmissive member 20 (e.g., if a top viewshape of the light-transmissive member 20 is a rectangular shape, alength of a diagonal line of the rectangular shape) from the center ofthe first region 20 a. Also, the expression “lateral end part” of thesecond region 20 b includes a region at a distance of 5% or less of themaximum width of the light-transmissive member 20 (e.g., if a top viewshape of the light-transmissive member 20 is a rectangular shape, alength of the diagonal line of the rectangular shape) from the lateralend of the second region 20 b.

As shown in FIGS. 1B and 1C, in the light emitting device 100 of thefirst embodiment, the concentration of the light scattering member 28 islowest at the center part of the first region 20 a, and is highest atthe side end part of the second region 20 b. With the light scatteringmember 28 distributed inside the light-transmissive member 20 with aconcentration relationship inverse to the fluorescent substance 25, itis possible to increase the uniformity of the scattering and/or thewavelength conversion rate of the light of the light emitting element 10in the light-transmissive member 20, and it is easy to reduce unevennessin the light emission color distribution. In particular, in the exampleshown in FIGS. 1B and 1C, the light scattering member 28 is disposed atthe center part of the first region 20 a and the lateral end part of thesecond region 20 b. In more detail, the light scattering member 28 isdisposed continuously from the center part of the first region 20 a tothe side end part of the second region 20 b. Then, the concentration ofthe light scattering material 28 is gradually increased from the centerof the first region 20 a to the lateral end of the second region 20 b.

As shown in FIGS. 1B and 1C, in the light emitting device 100 of thefirst embodiment, the light guide member 30 does not contain afluorescent substance. This allows for reducing heat generation in thelight guide member 30. Therefore, it is possible to facilitate drawingheat generated by the fluorescent substance 24, particularly the heat inthe second region 20 b, via the light guide member 30. Also, reductionin degradation of the light guide member 30 can be expected.

As shown in FIGS. 1B and 1C, the light emitting element 10 includes alight-transmissive substrate 11 and a semiconductor layered body 15.Also, the top surface of the light emitting element 10 is a surface ofthe substrate 11. In the light emitting element 10, light and heat isgenerated from the semiconductor layered body 15, and has a thickness ofapproximately several micrometers, which is relatively small.Accordingly, with the substrate 11 disposed between the semiconductorlayered body 15 and the light-transmissive member 20, the light emittedfrom the semiconductor layered body 15 propagates inside the substrate11 and appropriately expands laterally, so that preferable lightdistribution for the light-transmissive member 20 which has the secondregion 20 b, and thus reduction in unevenness of the light emissioncolor distribution can be facilitated. Also, with the light-transmissivemember 20 disposed distant from the semiconductor layered body 15, theeffect of intense light and great heat emitted by the semiconductorlayered body 15 is reduced, so that degradation of thelight-transmissive member 20 can be reduced.

As shown in FIGS. 1B and 1C, electrodes 50 are disposed on the bottomsurface of the light emitting element 10. Then, the electrodes 50configure a portion of the bottom surface of that light emitting device100. Such a light emitting device 100 is called, for example, “a chipsize package (CSP) type”, and can be formed to be smaller than the PLCC(Plastic Leaded Chip Carrier) type. The electrodes 50 are made of ametal material, are terminals for supplying power to the light emittingelement 10, and are also functions to dissipate heat in the lightemitting device 100. In the light emitting device 100 of a small size,distance between the heat generating part and the electrodes 50 can bereduced, which allows for increasing heat dissipation via the electrodes50.

Method of Manufacturing Light Emitting Device 100

The method for manufacturing the light emitting device 100 of the firstembodiment includes providing the light-transmissive member 20, thatincludes the first region 20 a directly above the top surface of thelight emitting element 10 and the second region 20 b at a lateral sideof the first region 20 a, above the light emitting element 10, in whichthe lateral surfaces of the light emitting element 10 and the bottomsurface of the second region 20 b of the light-transmissive member arecovered by the light guide member 30 (i.e., first step); and coveringthe outer surface of the light guide member 30 with the light reflectivemember 40 (i.e., second step). The light-transmissive member 20 containsthe fluorescent substance 25, and the light scattering member 28 whichis not a fluorescent substance, where the concentration of thefluorescent substance 25 is higher in the first region 20 a than in thesecond region 20 b and the concentration of the light scatteringmaterial 28 is higher in the second region 20 b than in the first region20 a.

In the method of manufacturing the light emitting device 100 having sucha configuration, the light-transmissive member 20 can be provided inwhich distribution of the fluorescent substance 25 and the lightscattering member 28 is appropriately controlled, and thelight-transmissive member 20, the light emitting element 10, and thelight guide member 30 can be connected with a preferable relationship.Therefore, the light emitting device 100 in which heat is easily drawnfrom the fluorescent substance 25 and unevenness in the light emissioncolor distribution reduced can be manufactured with good productivity.

FIGS. 2A, 2B, 2C, and 2D are schematic cross sectional viewsillustrating a first stage, second stage, third stage, and fourth stage,respectively, of the method of manufacturing the light emitting device100 of the first embodiment. Here, the first step includes the firststage and the second stage, and the second step includes the thirdstage. As described hereafter, the light emitting device 100 of thefirst embodiment can be manufactured with better productivity byfabricating a light emitting device collective body 150, and by dividingthat light emitting device collective body 150.

As shown in FIG. 2A, the first stage is the stage for providing thelight-transmissive member 20. More specifically, the light-transmissivemember 20 is obtained, for example, by forming a sheet member 209 thatcontains the fluorescent substance 25 and the light scattering member28, and then dividing that sheet member 209. In other words, this sheetmember 209 is a collective body of light-transmissive members 20. At thefirst stage of this the first embodiment, the light-transmissive member20 is provided as a portion of the sheet member 209. To form the sheetmember 209, either or both of a first element sheet containing thefluorescent substance 25 and a second element sheet containing the lightscattering material 28 is preferably formed in advance. In this manner,distribution of the fluorescent substance 25 and the light scatteringmaterial 28 can be suitably controlled in the sheet member 209, and thusin the light-transmissive member 20, which can facilitate providing thelight-transmissive member 20 with good productivity. In particular, itis preferable that the first and second element sheets be formed using ametal mold. This can facilitate suitably controlling the distribution ofthe fluorescent substance 25 and the light scattering material 29 withinthe sheet member 209, and thus in the light-transmissive member 20,which allows for easily providing the light-transmissive member 20 withbetter productivity. Also, when bonding the first and second elementsheets, the main material of at least one (preferably both) of the firstand second element sheets is preferably in a state of not beingcompletely hardened or solidified, in view of reducing bonding strengthof the element sheets and/or distortion in the sheet member 209. Also,in view of the same, it is preferable that the boundary, in other words,the interface, between the first and second element sheets bonded withthe sheet member 209 is not observed, but the boundary may be observed.The expression “a state of not completely hardened or solidified” refersto a state where the hardening or solidifying has progressed to somedegree, and for example, is a state called semi-hardened, B stage, gelform, or semi-solidified. Also, the first and second element sheets arenot limited to a shape with undulations as shown in FIG. 2A, and theshape can be selected appropriately as long as a predetermineddistribution of the fluorescent substance 25 and the light scatteringmaterial 28 can be obtained after bonding.

As shown in FIG. 2B, the second stage is a stage for providing thelight-transmissive member 20 above the light emitting element 10 via thelight guide member 30. More specifically, first, a light guide memberliquid material 301 is applied on one or both of the light emittingelement 10 and the light-transmissive member 20 (in the firstembodiment, the sheet member 209). Then, after the light emittingelement 10 and the light-transmissive member 20 are connected via thelight guide member liquid material 301, the light guide member liquidmaterial 301 is hardened or solidified. When the light guide memberliquid material 301 is applied on the light-transmissive member 20,after applying the light guide member liquid material 301 on a region ofthe light-transmissive member 20 containing a high concentration of thefluorescent substance 25, which will become the first region 20 a, themain light emitting surface (i.e., a surface that will later become thetop surface) of the light emitting element 10 is connected to the lightguide member liquid material 301. When the light guide member liquidmaterial 301 is applied on the light emitting element 10, after applyingthe light guide member liquid material 301 on the main light emittingsurface (i.e., the surface that will later become the top surface) ofthe light emitting element 10, the region of the light-transmissivemember 20 containing a high concentration of the fluorescent substance25, which will become the first region 20 a, is connected to the lightguide member liquid material 301. At this time, the light guide memberliquid material 301 is made to reach the second region 20 b, and is madeto creep up the lateral surfaces of the light emitting element 10. Forthe coating method of the light guide member liquid material 301, it ispossible to use a dispensing method, a transfer method, a dippingmethod, etc. Also, of the two principal surfaces of thelight-transmissive member 20 (in the first embodiment, the sheet member209), i.e., the top surface and the bottom surface of the sheet member209 in FIG. 2B, the light emitting element 10 is preferably connectedto, though either is acceptable, the surface at a side with a higherconcentration of the fluorescent substance 25. With this arrangement,heat emitted by the fluorescent substance 25 can be easily drawn via thelight emitting element 10. Further, the fluorescent substance 25 can bedisposed farther from the external environment to be easily protected,so that the light emitting device can have high reliability even in thecase of, for example, using the fluorescent substance 25 which isvulnerable to moisture, etc.

As shown in FIG. 2C, in the third stage, the outer surfaces of the lightguide members 30 is covered by the light reflective member 40. Morespecifically, the light reflective member liquid material 401 is appliedon the outer surface of the light guide member 30 and is hardened orsolidified. In the first embodiment, the light reflective member liquidmaterial 401 continuously covers the outer surfaces of the light guidemembers 30 each surrounding a respective one of a plurality of the lightemitting elements 10, so that a collective light reflective member 409is formed. At this time, it is preferable that the light reflectivemember liquid material 401 reaches a surface of the light emittingelement 10 opposite to the main light emitting surface of the lightemitting element 10 (i.e., a portion of a surface that will later becomethe bottom surface of the light emitting device other than the positiveand negative electrodes). With the light reflective member 40continuously covering from the outer surface of the light guide member30 to the surface opposite to the main light emitting surface of thelight emitting element 10 (i.e., a portion of the surface that willlater become the bottom surface of the light emitting device other thanthe positive and negative electrodes), it is possible to increase theextraction efficiency of light in the principal light emittingdirection. The light reflective member 40 can be formed usingcompression molding, transfer molding, injection molding, potting, etc.To expose the electrodes 50 from the light reflective member 40, forexample, the amount of the light reflective member 40 is adjusted to besmall, grinding is performed after forming a large amount of the lightreflective member 40, or the light reflective member 40 is formed in astate where the surface of the electrodes 50 is masked.

As shown in FIG. 2D, in the fourth stage, the light emitting devicecollective body 150 is divided. More specifically, at a predeterminedposition in the light emitting device collective body 150, morespecifically, in the region between the light emitting elements 10 wherethe sheet member 209 and the light reflective member collective body 409is layered, cutting is performed linearly or in a grid-shaped manner, sothat the light emitting devices 100 is singulated. To cut the lightemitting device collective body 150, for example, it is possible to usea dicer, an ultrasonic cutter, a Thomson blade, etc. In the case ofmanufacturing the light emitting devices 100 individually one at a time,it is possible to omit this fourth stage.

Second Embodiment

FIG. 3A is a schematic top view of a light emitting device 200 of thesecond embodiment of the present invention. FIG. 3B is a schematic crosssectional view taken along a line C-C of the light emitting device 200shown in FIG. 3A. FIG. 3C is a schematic cross sectional view takenalong a line D-D of the light emitting device 200 shown in FIG. 3A.Configurations of the light emitting device 200 that differ from thelight emitting device 100 of the first embodiment will be describedbelow, and description of configurations substantially the same as thatin the light emitting device 100 of the first embodiment will be omittedas appropriate.

As shown in FIGS. 3B and 3C, in the light emitting device 200 of thesecond embodiment, a second region 22 b includes a fluorescentsubstance-containing portion 22 c and a fluorescent substance-freeportion 22 d at a lateral side of the fluorescent substance-containingportion 22 c. More specifically, the region in the second region 22 b inwhich the fluorescent substance 25 is distributed is predominant at thelight emitting element 10 side. Accordingly, heat generating region dueto the fluorescent substance 25 and the non-heat generating region canbe clearly divided from each other in a latera direction in the secondregion 22 b, so that and facilitation of the drawing of heat from theheat generating region to the non-heat generating region can beexpected. The boundary between the fluorescent substance-containingportion 22 c and the fluorescent substance-free portion 22 d is mostpreferably parallel to the thickness direction of the light-transmissivemember 22, i.e., the Z direction, but in accordance with the processingprecision, etc., during manufacturing, an inclination of 10° or lesstoward the inside or the outside may be accepted. The fluorescentsubstance-containing portion 22 c is continuous in the first region 22a. In particular, in the example shown in FIGS. 3B and 3C, thefluorescent substance-containing portion 22 c is disposed across anentirety of the first region 22 a. Further, in the example shown inFIGS. 3B and 3C, the concentration of the fluorescent substance 25 inthe fluorescent substance-containing portion 22 c is uniform across theentire region, but may be different depending on the location. Forexample, the concentration of the fluorescent substance 25 in thefluorescent substance-containing portion 22 c in the first region 22 amay be higher than the concentration of the fluorescent substance 25 inthe fluorescent substance-containing portion 22 c in the second region22 b.

The second region 22 b may not contain the fluorescent substance 25.This allows for reducing heat generation in the second region 22 bgreatly easily, so that degradation of the second region 22 b due toheat can be even further reduced.

As shown in FIGS. 3B and 3C, in the light emitting device 200 of thesecond embodiment, the light guide member 32 contains the secondfluorescent substance 26. Accordingly, lack of the fluorescent substance25 in the second region 22 b is compensated, so that unevenness of thelight emission color distribution can be reduced. This is particularlysuitable in the case where the second region 22 b includes thefluorescent substance-free portion 22 d. Then, in the examples shown inFIGS. 3B and 3C, the concentration of the second fluorescent substance26 in the light guide member 32 is higher at the lower side than theupper side. With this arrangement, heat generation is can be reduced atthe upper part of the light guide member 32, more specifically, thesecond region 22 b side, which allows for facilitating drawing the heatgenerated by the fluorescent substance 25, particularly the heat in thesecond region 22 b, to the light guide member 32. Also, in the casewhere the top surface of the light emitting element 10 is a surface ofthe substrate 11 as described above, heat generated by the secondfluorescent substance 26 can be easily drawn toward the bottom surfaceside and the semiconductor layered body 15 side.

As shown in FIG. 3A to 3C, in the light emitting device 200 of thesecond embodiment, the lateral surfaces of the light-transmissive member22 is covered by the light reflective member 42. With this arrangement,leaking of light from the light-transmissive member 22 in a lateraldirection can be reduced, and thus unevenness in the light emissioncolor distribution can be reduced. Further, drawing of heat from thesecond region 22 b to the light reflective member 42 can be expected. Inview of this, it is preferable that the light reflective member 42 covera half or more of the surface area of each lateral surface of thelight-transmissive member 22 in the thickness direction of thelight-transmissive member 22, more preferable that it cover three-fifthor more of the surface area of each lateral surface of thelight-transmissive member 22, and even more preferable that it cover anentirety of each lateral surface of the light-transmissive member 22.

Alternatively, as in the light emitting device 100 of the firstembodiment, the entire area of each lateral surface of thelight-transmissive member 20 is exposed from the light reflective member40, in other words, forms a portion of respective one of the lateralsurfaces of the light emitting device 100. This allows for easilyincreasing light extraction efficiency.

Method of Manufacturing Light Emitting Device 200

FIGS. 4A, 4B, 4C, and 4D are schematic cross sectional viewsillustrating a first stage, second stage, third stage, and fourth stage,respectively of the method for manufacturing the light emitting device200 of the second embodiment. Hereafter, configurations that differ fromthe method of manufacturing the light emitting device 100 of the firstembodiment will be described, and description of configurations that aresubstantially the same as the method for manufacturing the lightemitting device 100 of the first embodiment will be omitted asappropriate.

As shown in FIG. 4A, the first stage is the stage when thelight-transmissive member 22 is provided. More specifically, thelight-transmissive members 22 are obtained by, for example, forming asheet member 229 that contains the fluorescent substance 25 and thelight scattering material 28, and dividing this sheet member 229. Inother words, the sheet member 229 is a collective body of thelight-transmissive members 22. Also, in the first stage of the secondembodiment, the light-transmissive member 22 is provided by dividing thesheet member 229 into blocks before connecting with the light emittingelements 10. To form the sheet member 229, it is preferable to form, inadvance, the plurality of blocks containing the fluorescent substance25, or a sheet that contains the light scattering material 28 with aplurality of openings (e.g., a grid-shaped sheet). This allows foreasily controlling the distribution of the fluorescent substance 25 andthe light scattering material 28 in the sheet member 229 to be asuitable distribution, and thus allows for facilitating providing thelight-transmissive member 22 with good productivity. In the case wherethe block containing the fluorescent substance 25 is formed, the sheetmember 229 can be formed by arranging a plurality of blocks containingthe fluorescent substance 25 to be separated from each other on anadhesive sheet, etc., filling a liquid material containing the lightscattering material 28 in the separated region, and then performinghardening or solidifying. In the case where the sheet containing thelight scattering material 28 with openings is formed, the sheet member229 can be formed by placing the sheet with openings containing thelight scattering material 28 on an adhesive sheet, etc., filling theliquid material containing the fluorescent substance 25 inside each ofthe openings, and then performing hardening or solidifying. For cuttingthe sheet member 229, it is possible to use, for example, a dicer, anultrasonic cutter, or a Thomson blade.

As shown in FIG. 4B, in the second stage, the light-transmissive member22 is placed above the light emitting element 10 via the light guidemember 32. More specifically, a light guide member liquid material 321is applied on one or both of the light emitting element 10 and thelight-transmissive member 22. Then, after the light emitting element 10and the light-transmissive member 22 are connected via the light guidemember liquid material 321, the light guide member liquid material 321is hardened or solidified. When the light guide member liquid material321 is applied on the light-transmissive member 22, after applying thelight guide member liquid material 321 on the region of thelight-transmissive member 22 containing a high concentration of thefluorescent substance 25, which will become the first region 22 a, thetop surface of the light emitting element 10 is connected to the lightguide member liquid material 321. When the light guide member liquidmaterial 321 is applied on the light emitting element 10, after applyingthe light guide member liquid material 321 on the top surface of thelight emitting element 10, the region of the light-transmissive guide 22containing a high concentration of the fluorescent substance 25, whichwill become the first region 22 a, is connected to the light guidemember liquid material 321. At this time, the light guide member liquidmaterial 321 is made to reach the second region 22 b, and is made tocreep up the lateral surfaces of the light emitting element 10. Also, bythe time the light guide member liquid material 321 is completelyhardened or solidified, the second fluorescent substance 26 isprecipitated by gravity or centrifugal force, which allows for unevenlydistributing the second fluorescent substance 26 to be predominantlydisposed in a desired direction.

As shown in FIG. 4C, in the third stage, the outer surfaces of the lightguide members 32 is covered by the light reflective member 42. Morespecifically, the light reflective member liquid material 421 is appliedon the outer surfaces of the light guide members 32 and then hardened orsolidified. In the second embodiment, the light reflective member liquidmaterial 421 continuously covers the outer surfaces of the light guidemembers 32 of the plurality of light emitting elements 10, and thus isformed as a collective light reflective member 429. At this time, thelight reflective member liquid material 421 reaches the lateral surfacesof each light-transmissive member 22. To expose the main light emissionsurface of the light-transmissive member 22 from the light reflectivemember 42, for example, the amount of the light reflective member 42 isadjusted to be small, grinding is performed after forming a large amountof the light reflective member 42, or the light reflective member 42 isformed in a state with the primary light emission surface of thelight-transmissive member 22 masked.

As shown in FIG. 4D, in the fourth stage, the light emitting devicecollective body 250 is divided. More specifically, at a predeterminedposition in the light emitting device collective body 250, morespecifically, in the region between light-transmissive members 22 wherethe collective light reflective member 429 is disposed, cutting isperformed linearly or a grid-shaped manner, so that the light emittingdevice 200 can be singulated.

Hereafter, components of the light emitting device according to certainembodiments of the present invention will be described.

Light Emitting Element 10

For the light emitting element, a semiconductor light emitting elementis preferably used, but an organic EL element is may be used. An exampleof a semiconductor light emitting element includes an LED (lightemitting diode) chip. The semiconductor light emitting element includesa semiconductor layered body that configures the light emitting elementstructure, and may also further include a substrate. In a top view, thelight emitting element preferably has a rectangular shape, and inparticular a square shape or a rectangular shape elongated in onedirection. Lateral surfaces of the light emitting element or of thesubstrate therein may be perpendicular to the top surface thereof, ormay be inclined inward or outward. The light emitting element preferablyincludes positive and negative (p, n) electrodes on the same surfaceside. In the case where the light emitting element is a flip-chip (facedown) mounting type, the main light emission surface is opposite to theelectrode formation surface. A single light emitting element or aplurality of light emitting elements may be mounted in a single lightemitting device. The plurality of light emitting elements can beconnected in series or in parallel. In the case where the plurality oflight emitting elements are connected to a single light-transmissivemember, each of regions in the light-transmissive member directly abovethe top surface of respective one of the light emitting elements can beregarded as a first region, and the region at a lateral side of thefirst region, in other words, the region other than the first region,can be regarded as the second region.

Substrate 11

For the substrate, a substrate for crystal growth, on which asemiconductor crystal can be grown, is easily used, and thus ispreferable, but a substrate for bonding, to which a semiconductorlayered body separated from the substrate for crystal growth is bonded,may be used. With the light-transmissive substrate, flip-chip mountingcan be easily used, and light extraction efficiency can be easilyincreased. For the substrate, one of sapphire, gallium nitride, aluminumnitride, silicon, silicon carbide, gallium arsenide, gallium phosphide,indium phosphide, zinc sulfide, zinc selenide, and glass can be used.Among these, sapphire has good light-transmissivity, and is relativelylow cost and easy to obtain as a substrate for crystal growth of anitride semiconductor, and thus is preferable. Also, gallium nitride issuitable for a substrate for crystal growth of a nitride semiconductor,and is preferable in view of having relatively high thermalconductivity. A thickness of the substrate thickness can be selected asappropriate, but in view of light extraction efficiency, mechanicalstrength, etc., the substrate preferably has a thickness of 50 μm-500μm, and more preferably 80 μm-300 μm.

Semiconductor Layered Body 15

The semiconductor layered body includes an n-type semiconductor layerand a p-type semiconductor layer, and preferably includes an activelayer between them. For the semiconductor material, it is preferable touse a nitride semiconductor that can efficiently emit light of a shortwavelength, which easily excites the fluorescent substance. For thenitride semiconductor, the nitride semiconductor is mainly representedby the general formula In_(x)Al_(y)Ga_(1-x-y)N (0≤x, 0≤y, x+y≤1). Otherexamples of the nitride semiconductor include zinc sulfide, zincselenide, and silicon carbide. The peak emission wavelength of the lightemitting element is preferably in the blue light range in view of lightemitting efficiency, fluorescent substance excitation, and therelationship of mixing color with the emitted light, etc., and ispreferably in a range of 450 nm-475 nm. A thickness of the semiconductorlayered body can be selected as appropriate, but in view of lightemitting efficiency, crystallinity, etc., the semiconductor layered bodypreferably has a thickness of 1 μm to 10 μm, and more preferably 3 μm to10 μm.

Light-Transmissive Members 20, 22

The light-transmissive member has a function of transmitting light ofthe light emitting element to outside the device while protecting thelight emitting element, the light guide member, and the light reflectivemember from outside air and external forces, etc. The light-transmissivemember at least contains light-transmissive main material, and furthercontains a fluorescent substance in those main materials. In the topview, the light-transmissive member has a larger size than that of thelight emitting element, and preferably has a similar shape as the topview shape of the light emitting element in terms of light intensitydistribution and chromaticity distribution, etc. If the top surfaceand/or the bottom surface of the light-transmissive member is a flatsurface, productivity can be increased, and if the top surface and/orthe bottom surface of the light-transmissive member is a surface withirregularities or is a curved surface, the light extraction efficiencycan be increased. The light-transmissive member can be a single layer inthe thickness direction, or can be a layered body including a pluralityof layers. In the case where the light-transmissive member is a layeredbody, it is possible to use various different types of main materialsfor each layer, and possible to contain different types of fluorescentsubstance in each layer. Also, with the light-transmissive member havingthe outermost layer that does not contain a fluorescent substance,degradation of the fluorescent substance due to outside air, etc., canbe reduced. A thickness of the light-transmissive member can be selectedas appropriate, but in view of light extraction efficiency, thefluorescent substance content, etc., the light-transmissive memberpreferably has a thickness of 50 μm to 500 μm, and more preferably 80 μmto 300 μm.

Main Material of the Light-Transmissive Member

For the main material of the light-transmissive member, it is possibleto use at least one of silicone resin, epoxy resin, phenol resin,polycarbonate resin, acrylic resin, modified resins of these, and glass.Among these, silicone resin or its modified resin is preferable in viewof good heat resistance and light resistance. Specific examples of thesilicone resin include dimethyl silicone resin, phenyl methyl siliconeresin, and diphenyl silicone resin. In particular, a silicone resinincluding a phenyl group allows for enhancing the heat resistance andgas barrier properties. Of the total organic group bonded with siliconatoms in the silicone resin or a modified resin thereof, the content ofthe phenyl base is preferably 10 mol % to 70 mol %, and more preferably20 mol % to 60 mol %. The “modified resins” in this specificationinclude hybrid resins.

Fluorescent Substance 25, 26

The fluorescent substance absorbs at least a portion of light emittedfrom the light emitting element (i.e., primary light), and emits lightof a different wavelength from that of the primary light (i.e.,secondary light). This allows for obtaining a light emitting deviceconfigured to emit light of a wavelength of visible light primary lightand secondary light mixed color light such as white light, for example.In the case of a white-light emitting device, the emitted light colorrange preferably conforms to the ANSI C78.377 standard. The content ofthe fluorescent substance in the light-transmissive member can beselected as appropriate according to the desired chromaticity of emittedlight, but, for example, is preferably 40 parts by weight to 250 partsby weight, and more preferably 70 parts by weight to 150 parts byweight. “Parts by weight” represents weight (g) of the particles mixedin the weight 100 g of the main materials. The peak emission wavelengthof the green light emitting fluorescent substance is preferably in therange of 520 nm to 560 nm in view of mixed color relationship with lightof other light sources, etc. More specifically, examples of the greenlight emitting fluorescent substance include yttrium-aluminum-garnetbased phosphor (e.g., Y₃(Al, Ga)₅O₁₂:Ce), lutetium-aluminum-garnet basedphosphor (e.g., Lu₃(Al, Ga)₅O₁₂:Ce), terbium-aluminum-garnet basedphosphor (e.g., Tb₃(Al, Ga)₅O₁₂:Ce), silicate based phosphor (e.g., (Ba,Sr)₂SiO₄:Eu), chlorosilicate based phosphor (e.g., CasMg(SiO₄)₄C₁₂:Eu),β sialon based phosphor (e.g., Si_(6-z)Al_(z)O_(z)N_(9-z):Eu (0<z<4.2)),SGS based phosphor (e.g., SrGa₂S₄:Eu). Examples of the yellow lightemitting fluorescent substance include a sialon based phosphor (e.g.,Mz(Si, Al)₁₂(O,N)₁6 (where 0≤z≤2, and M is a lanthanide element exceptfor Li, Mg, Ca, Y, and La and Ce)). In addition, there are also yellowlight emitting fluorescent substances among the aforementioned greenlight emitting fluorescent substances. Also, for example, with theyttrium-aluminum-garnet based phosphors, substituting a portion of Ywith Gd allows for shifting the peak emission wavelength to the longerwavelength side, and possible to emit yellow light. Also, thesefluorescent substance include fluorescent substance that can emit orangelight. The peak emission wavelength of the fluorescent substancesadapted to emit red light is preferably in the range of 620 nm to 670 nmin view of the mixed color relationship with light of other lightsources, etc. More specifically, examples of the red light emittingfluorescent substance include nitrogen-containing calciumaluminosilicate (CASN or SCASN) based phosphor (e.g., (Sr,Ca)AlSiN₃:Eu), etc. Examples of the red light emitting fluorescentsubstance further include manganese-activated fluoride-based phosphors(phosphors represented by the general formula (I) A₂[M_(1-a)Mn_(a)F₆](where in the general formula (I), A is at least one element selectedfrom a group consisting of K, Li, Na, Rb, Cs, and NH₄, M is one elementselected from a group consisting of group 4 elements and group 14elements, and a satisfies 0<a<0.2)). A representative example of thismanganese activated fluoride based phosphor is a manganese activatedpotassium fluorosilicate phosphor (e.g. K₂SiF₆:Mn). For the fluorescentsubstance, one of the specific examples described above can be singlyused, or two or more thereof can be used in combination. For example,the fluorescent substance may be made of phosphors adapted to emit greento yellow light, and phosphors adapted to emit red light. With such aconfiguration, light emission with good color reproduction or colorrendering properties can be obtained. On the other hand, however, thisallows a large amount of the fluorescent substance to be used, andaccordingly heat generation is increased, so that the configuration ofthe light emitting device of this embodiment can easily exhibit effects.It is also particularly preferable that the red light emitting phosphorbe a manganese-activated fluoride-based phosphor. The manganeseactivated fluoride based phosphors can emit light with narrow half widthin the spectrum of the red light range, but has relatively low lightemitting efficiency, so that used amount thereof tends to be increased,and thus the heat generation easily increases. Therefore, theconfiguration of the light emitting device of this embodiment canfurther easily exhibit effects.

Light Scattering Material 28

For the light scattering material, an organic substance may be used, butan inorganic substance with good heat resistance and light resistance ispreferably used. Also, using an inorganic substance allows the lightscattering material to also function as a filler for adjusting thethermal conductivity, the coefficient of thermal expansion, etc., of thelight-transmissive member. For the inorganic substance, it is preferableto use at least one of silicon oxide, titanium oxide, magnesium oxide,zinc oxide, aluminum oxide, zirconium oxide, calcium carbonate, andbarium sulfate. Among these, magnesium oxide, zinc oxide, and aluminumoxide are preferable in terms of thermal conductivity. Also, siliconoxide, titanium oxide, and zirconium oxide is relatively inexpensive andeasy to obtain, and thus is preferable. Using an organic substance hasan advantage of being able to adjust optical characteristics usingcopolymerization, etc. More specifically, for the organic substance,polymethacrylic acid esters and copolymers thereof, polyacrylic acidesters and copolymers thereof, cross-linked polymethacrylic acid esters,cross-liked polyacrylic acid esters, polystyrene and copolymers thereof,cross-linked polystyrene, silicone resin, or modified resins of these ispreferably used. For the light scattering material, it is possible touse one of these singly, or to use a combination of two or more ofthese. The content of the light scattering material in thelight-transmissive member can be selected as appropriate, but it ispreferably 1 part by weight to 100 parts by weight, and more preferably5 parts by weight to 50 parts by weight. The shape of the lightscattering material can be selected as appropriate, and can be agranular type (amorphous), but a sphere is preferable in terms offilling ability, reduction in aggregation, etc.

Light Guide Members 30, 32

The light guide member is light-transmissive, and in addition to guidinglight of the light emitting element to the light-transmissive member, isalso able to adhere the light emitting element and thelight-transmissive member. The outer surface of the light guide member,that is, the interface between the light guide member and the lightreflective member, is preferably tilted or curved with respect to thelateral surfaces of the light emitting element and the bottom surface ofthe light-transmissive member, in view of light extraction efficiency.For the main materials of the light guide member, it is possible to useat least one of silicone resin, epoxy resin, phenol resin, polycarbonateresin, acrylic resin, modified resins of these, and glass. Among these,silicone resin or a modified resin thereof has good heat resistance andlight resistance, and thus is preferable. Specific examples of thesilicone resin include dimethyl silicone resin, phenyl methyl siliconeresin, and diphenyl silicone resin. In particular, with a phenyl group,the heat resistance and gas barrier properties are enhanced. The contentof the phenyl group in the total organic groups bonded to silicon atomsin the silicone resin or modified resin thereof is preferably 10 mol %to 70 mol %, and more preferably 20 mol % to 60 mol %. The light guidemember can also contain various fillers in the main material to adjustthe thermal conductivity, coefficient of thermal expansion, etc. Forsuch a filler, it is possible to use the same material as the lightscattering material of the aforementioned inorganic substance.

Light Reflective Members 40, 42

The light reflective member is preferably white in view of lightextraction efficiency. Thus, the light reflective member preferablycontains white pigment in the main material. For the main material ofthe light reflective member, it is possible to use at least one ofsilicone resin, epoxy resin, phenol resin, polycarbonate resin, acrylicresin, modified resins of these, and glass. Among these, silicone resinor a modified resin thereof has good heat resistance and lightresistance, and thus is preferable. Specific examples of the siliconeresin include dimethyl silicone resin, phenyl methyl silicone resin, anddiphenyl silicone resin. In particular, with a phenyl group, the heatresistance and gas barrier properties are enhanced. The content of thephenyl group in the total organic groups bonded to silicon atoms in thesilicone resin or modified resin thereof is preferably 10 mol % to 70mol %, and more preferably 20 mol % to 60 mol %. For the white pigment,it is possible to use singly one of or a combination of two or more oftitanium oxide, zinc oxide, magnesium oxide, magnesium carbonate,magnesium hydroxide, calcium carbonate, calcium hydroxide, calciumsilicate, magnesium silicate, barium titanate, barium sulfate, aluminumhydroxide, aluminum oxide, and zirconium oxide. Among these, titaniumoxide has good light reflectivity and is relatively inexpensivelyobtained. The content of white pigment within the light reflectivemember can be selected as appropriate, but in view of light reflectivityand viscosity in a state of a liquid material, it is preferably 20 partsby weight to 300 parts by weight, and more preferably 50 parts by weightto 200 parts by weight.

Electrode 50

The electrodes 50 can be the positive and negative electrodes of thelight emitting element, or can be different electrodes connected to thepositive and negative electrodes of the light emitting element. Examplesof such different electrodes include bumps, pillars, or lead electrodes(singulated lead frames), etc. The electrodes can be small pieces ofmetal or an alloy. More specifically, it is possible to use at least oneof gold, silver, copper, iron, tin, platinum, zinc, rhodium, titanium,nickel, palladium, aluminum, tungsten, chrome, molybdenum, and alloys oftwo or more of these. Among these, copper has good thermal conductivityand is relatively inexpensive, so copper or a copper alloy ispreferable. Also, gold is also chemically stable and surface oxidationthereof is small, which facilitates bonding, and thus gold or a goldalloy is also preferable. In view of solder bondability, the electrodescan also have a gold or silver film on the surface.

The top view type light emitting devices was described above as anexample of the light emitting devices of the first and secondembodiments, but the light emitting device may be a side view type lightemitting device according to the positional relationship of theelectrodes terminals with respect to the principal light emissiondirection. The mounting direction of the top-view type light emittingdevice is substantially parallel to the principal light emissiondirection, and is the reverse direction with respect to the principallight emission direction. For example, the light emitting device of thefirst and second embodiments is mounted in a downward direction. On theother hand, the side surface emission type light emitting device ismounted substantially perpendicularly to the principal light emissiondirection. Also, for the light emitting devices of the first and secondembodiments, a light emitting device without a mounting substrate onwhich the light emitting element is to be mounted is used as an example,but a light emitting device in which the light emitting element ismounted on a mounting substrate may be alternatively used. In that case,at the second stage (FIG. 2B, FIG. 4B), the light emitting elementbonded by solder, etc., on the wiring of the mounting substrate is used,and at the third stage (FIG. 2C, FIG. 4C), the light reflective memberis formed on the mounting substrate. After that, if the mountingsubstrate is in a state of a collective substrate, at the fourth stage(FIG. 2D, FIG. 4D), the mounting substrate can be cut together with thesheet member and the light reflective member, etc.

EXAMPLE

An example according to one embodiment of the present invention will bedescribed below in detail. It is noted that the present invention is notlimited only to the example shown below.

Example 1

The light emitting device of Example 1 is a top surface-emitting CSPtype LED device having a rectangular-parallelepiped shape with a widthof 1.7 mm, a depth of 1.7 mm, and a thickness of 0.28 mm, and having thestructure of the light emitting device 100 of the example shown in FIG.1A to 1C. The light emitting element 10 is an LED chip of width 1 mm,depth 1 mm, thickness 0.155 mm with a square shape in a top view thatcan emit blue light at light emission peak wavelength of 455 nm. Thelight emitting element 10 has a sapphire substrate 11, and asemiconductor layered body 15 in which an n type semiconductor layer ofa nitride semiconductor, an active layer, and a p type semiconductorlayer are layered in order on the sapphire substrate 11 so as to be incontact with the bottom surface of that substrate 11. Thelight-transmissive member 20 is disposed above the light emittingelement 10 and connected to the light emitting element 10 via the lightguide member 30. The light-transmissive member 20 is a small piece of aphosphor-containing resin sheet that has a square shape in a top viewand has a width of 1.7 mm, a depth of 1.7 mm, and thickness of 0.1 mm.In the top view, the center and orientation of the light emittingelement 10 corresponds to the light-transmissive member 20 (note thatmanufacturing errors are allowed). The light-transmissive member 20 isconfigured by two layers described below, an upper layer and lowerlayer. However, a boundary between the upper layer and lower layer isnot observed. The lower layer is, as the fluorescent substance 25, ahardened substance of phenyl methyl silicone resin that contains 3sialon based phosphor and manganese-activated fluoride based phosphor.The upper layer is, as the light scattering material 28, a hardenedsubstance of a phenyl methyl silicone resin containing sphericalparticles of aluminum oxide of average particle diameter of 20 to 25 nm.A thickness of the lower layer is gradually increased toward the centerof the first region 20 a from the lateral end of the second region 20 b.Then, the fluorescent substance 25 is distributed at substantiallyuniform concentration in the entire area of the lower layer(specifically, at volumetric concentration of 25%). Thus, theconcentration of the fluorescent substance 25 in the light-transmissivemember 20 is lowest at the lateral end part of the second region 20 b,and is highest at the center part of the first region 20 a. On the otherhand, a thickness of the upper layer is gradually increased toward thelateral end of the second region 20 b from the center of the firstregion 20 a. Then, the light scattering material 28 is distributed atsubstantially uniform concentration in the entire region of the upperlayer (specifically, at volumetric concentration of 4.5%). Thus, theconcentration of the light scattering material 28 in thelight-transmissive member 20 is lowest at the center part of the firstregion 20 a, and highest at the lateral end part of the second region 20b. The light guide member 30 covers the top surface of the lightemitting element 10 and the bottom surface of the first region 20 a ofthe light-transmissive member, the four lateral surfaces of the lightemitting element 10, and the bottom surface of the second region 20 b ofthe light-transmissive member. The outer surface of the light guidemember 30 is inclined or curved with respect to the lateral surfaces ofthe light emitting element 10 and the bottom surface of the secondregion 20 b of the light-transmissive member. The light guide member 30is a hardened substance of phenyl methyl silicone resin that does notcontain a fluorescent substance. The light reflective member 40 coversthe outer surface of the light guide member 30 at a lateral side of thelight emitting element 10, and covers the region except for the positiveand negative electrodes of the bottom surface of the light emittingelement 10 below the light emitting element 10. In the case where aportion (i.e., a bottom part) of each of the lateral surfaces of thelight emitting element 10 is not covered by the light guide member 30,the light reflective member 40 covers the portion (i.e., bottom part) ofthe side surface of the light emitting element 10. The light reflectivemember 40 is a hardened substance of the phenyl methyl silicone resinthat contains 150 parts by weight of titanium oxide. Each of theelectrodes 50 is connected to a respective one of the positive andnegative electrodes formed on the bottom surface of the semiconductorlayered body 15 of the light emitting element. The electrodes 50 aresmall pieces of copper on which a nickel/gold layered film is disposedwith a thickness of 0.025 mm. The bottom surface of each of theelectrodes 50, that is, a surface of the gold layer of the layered film,is exposed from the light reflective member 40. In more detail, thebottom surface of this light emitting device 100 includes the bottomsurface of the light reflective member 40 and the bottom surface of eachof the electrodes 50.

The light emitting device according to the Example 1, as describedhereafter, is manufactured by forming the light emitting devicecollective body 150, and then dividing that light emitting devicecollective body 150 using a dicing apparatus. The sheet member 209 isfabricated by pressure bonding and completely hardening a semi-hardenedfirst element sheet and a semi-hardened second element sheet. Thefluorescent substance 25 is distributed in the first element sheet and athickness of the first element sheet varies so as to form a lateral andlongitudinal periodic pattern of distribution of an amount of thefluorescent substance 25 and a thickness approximate to that of theaforementioned lower layer of the light-transmissive member 20.Likewise, the light scattering material 28 is distributed in the secondelement sheet and a thickness of the second element sheet varies so asto form a lateral and longitudinal periodic pattern of distribution ofan amount of the light scattering material 28 and a thicknessapproximate to that of the aforementioned upper layer of thelight-transmissive member 20. Next, on each of regions of that sheetmember 209 containing high concentrations of the fluorescent substance25, the light guide member liquid material 301 is applied using a pintransfer method. Next, the substrate 11 side of the light emittingelement 10, in which a small piece of copper is connected to each of thepositive and negative electrodes, is mounted on each light guide memberliquid material 301 applied on the sheet member 209. At this time, thepushing amount of the light emitting element 10 is adjusted to allow thelight guide member liquid material 301 to be spread on the sheet member209 and to creep up on the four lateral surfaces of the light emittingelement 10. Then, the light guide member liquid material 301 is hardenedin an oven. Next, the light reflective member liquid material 401 isfilled using a compression molding method so as to bury all of the lightemitting element 10, and is hardened. Then, the obtained lightreflective member collective body 409 is ground to expose the smallpieces of copper. After that, a nickel/gold layered film is formed on anexposed surface of each copper small piece using a sputtering device, sothat the electrodes 50 are formed. Then, the light emitting devicecollective body 150 obtained in such manner as described above is cutinto grid form.

The light emitting device of Example 1 configured as described above isable to exhibit similar effects as those of the light emitting device100 of the first embodiment.

The light emitting device of the first embodiment of the presentinvention can be used for a backlight device for a liquid crystaldisplay apparatus, various types of illumination equipment, large sizeddisplay apparatuses, various types of display apparatuses foradvertising or a destination guide, etc., projector devices, and alsofor image reading devices of digital video cameras, fax machines, copymachines, scanners, etc.

What is claimed is:
 1. A method for manufacturing a light emittingdevice comprising: placing a light-transmissive member, which includes afirst region and a second region at a lateral side of the first region,above a light emitting element so that the first region of thelight-transmissive member is positioned directly above a top surface ofthe light emitting element, and a lateral surface of the light emittingelement and a bottom surface of the second region of thelight-transmissive member are covered by a light guide member; andcovering an outer surface of the light guide member with a lightreflective member, wherein the light-transmissive member contains afluorescent substance and a light scattering material that is not afluorescent substance, a concentration of the fluorescent substance inthe light-transmissive member is higher in the first region than in thesecond region, and a concentration of the light scattering material inthe light-transmissive member is higher in the second region than in thefirst region.
 2. The method for manufacturing a light emitting deviceaccording to claim 1, wherein the placing of the light-transmissivemember includes a first stage in which the light-transmissive member isprovided, and a second stage in which the light-transmissive member isplaced above the light emitting element via the light guide member. 3.The method for manufacturing a light emitting device according to claim2, wherein the first stage includes forming at least one of a firstelement sheet containing the fluorescent substance and a second elementsheet containing the light scattering material in advance.
 4. The methodfor manufacturing a light emitting device according to claim 3, whereinthe forming of the at least one of the first element sheet and thesecond element sheet includes forming the at least one of the firstelement sheet and the second element sheet using a metal mold.
 5. Themethod for manufacturing a light emitting device according to claim 3,wherein the forming of the at least one of the first element sheet andthe second element sheet includes forming the at least one of the firstelement sheet and the second element sheet in a shape with undulations.6. The method for manufacturing a light emitting device according toclaim 2, wherein the first stage includes forming, in advance, at leastone of a block containing the fluorescent substance, and a sheetcontaining the light scattering material with an opening.
 7. The methodfor manufacturing a light emitting device according to claim 2, whereinthe first stage includes arranging a plurality of blocks containing thefluorescent substance to be separated from each other, filling a liquidmaterial containing the light scattering material in a separated regionbetween the blocks, and performing hardening or solidifying of theliquid material.
 8. The method for manufacturing a light emitting deviceaccording to claim 2, wherein the first stage includes forming a sheetcontaining the light scattering material with an opening, filling aliquid material containing the fluorescent substance inside the opening,and performing hardening or solidifying of the liquid material.
 9. Themethod for manufacturing a light emitting device according to claim 2,wherein the second stage includes applying a light guide member liquidmaterial on at least one of the light emitting element and thelight-transmissive member.
 10. The method for manufacturing a lightemitting device according to claim 1, further comprising cutting thelight reflective member to singulate the light emitting device.
 11. Themethod for manufacturing a light emitting device according to claim 1,wherein an average particle diameter of the light scattering material issmaller than a peak emission wavelength of the light emitting element.12. The method for manufacturing a light emitting device according toclaim 1, wherein the placing of the light-transmissive member includesproviding the light-transmissive member that does not contain thefluorescent substance in the second region.
 13. The method formanufacturing a light emitting device according to claim 1, wherein thelight guide member does not contain the fluorescent substance.
 14. Themethod for manufacturing a light emitting device according to claim 1,further comprising providing the light emitting element that has alight-transmissive substrate and a semiconductor layered body, and asurface of the light-transmissive substrate constitutes the top surfaceof the light emitting element.
 15. The method for manufacturing a lightemitting device according to claim 1, further comprising providing thelight emitting element in which electrodes are provided at a bottomsurface of the light emitting element, wherein the covering of the outersurface of the light guide member with the light reflective memberincludes exposing a part of the electrodes so that the part of theelectrodes constitutes a portion of a bottom surface of the lightemitting device.